Laser Etching Machine RZ-8060DH
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Laser Etching Machine RZ-8060DH

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Equipment compatible product size: ≤ 800mm × 600 mm. It is applicable to etching of 21 inch wide materials and below capacitive touch screen visual area and wire area


The equipment configuration adopts a dual optical path system to realize high-speed synchronous etching of small and medium-sized touch screen lines with thin line width, which increases the etching efficiency of the equipment by 50%~80%.


The software control has the function of intelligent data blocking to meet the requirements of special-shaped typesetting, improve the use efficiency of materials, and reduce the loss of materials.

Double CCD automatic correction, various correction methods, ensure the accuracy of etching and meet customer needs;


Etching line pitch can reach below 20 microns, which can be etched with ultra-fine line width silver paste, meeting the customer's demand for narrow frame touch screen, etc



Processing materials

Silver paste, ITO, CNT, graphene, etc

Silver glue printing thickness/uniformity

8±2μm

Etching line width

30μm ~40μm(Depending on the processing material)

Linearity

≤±5μm

Integrated positioning accuracy

≤±10μm(Eliminate material printing errors)

Repetitive machining accuracy

≤±2μm

Splicing accuracy

≤10μm

Effective absorption format

800 mm×600 mm

CCD alignment size

800 mm×600 mm

Positioning method

Double CCD automatic positioning

Processing speed

≤8000 mm/s (Depending on specific materials)

Single PCS processing range

320 mm×160 mm



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